产品名称ME7155-M
Stress Free
Solvent FreeThermally Conductive
Reworkable
Epoxy Paste Adhesive
DEAL FOR: High Power Die Attach Substrate and Component Reworka bility Mismatched CTE'S
DESCRIPTION:
ME7155-M is a flexible, alumina filled, electrically insulating andthermally conductive epoxy paste adhesive which exhibits outstandingflexibility for bonding materials having highly mismatched CTES(I.ealumina to aluminum, silicon to copper). The high thermal conductivityof this material makes it useful for bonding high-powered, large areadie and components.
It can be readily reworked at 80-100℃.
AVAILABILITY:
ME7155-M is available in syringes for automatic needle dispenseapplications or in jars.
APPLICATION PROCEDURES:
(1) Remove from freezer in original sealed package.
(2) Thaw for 30 to 60 minutes at 25'C before using.
(3) Dispense adhesive onto clean substrate.
(4) Cure according to one of the recommended cure schedules.
TYPICAL PROPERTIES*
CURE SCHEDULES:
Temperature Time Presure
80ºC 8-16hr
100ºC 4-8hr
125ºC 2-4hr
150ºC 1-2hr
175ºC 10-20min
Pot life is 5 days at 25ºC.
SHELF LIFE:
Storage temperature Shelf Life
-40ºC 1yr