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产品描述
CT220HK-S1是以环氧树脂为基材的无溶剂型银浆，适合蘸胶工艺。能够适合于小型芯片的LED的装片用途，具有优异的可靠性。
1.Introduction
Die Attach Paste CT220HK-S1 is a epoxy resin based and non solvent type paste. This paste is
effectively used for LED chip mounting because of its high adhesive strength.
2.Features
1) Good workability due to one liquid type.
2) High adhesive strength.
3) Bleedless during cure.
4) Low ionic impurity content, and high reliability.
3.General Property
4. Standard Cure Condition
150℃×1.5h
5. Remarks
Storage condition is under –15 degrees C
