NP560是一款免洗锡膏，具有无卤、低残留等有点，在PCB上应用时Void明显改善。

NP560 is a no-clean, lead-free, halogen-free solder paste. It consistently delivers paste transfer efficiencies of 0.50 to 0.55 AR and is fully capable of printing and reflowing 01005 components, even in air, with minimal graping behavior. In addition to its stable, consistent product performance, NP560 has redefined the voiding standard for PCB assembly and has the potential for low voiding performance.

Performance Characteristics:

■ Classified as ROL0 per J-STD-004B                ■ Excellent activity and printability

■ Halogen-Free                                     ■ Very low graping

■ Low voiding potential under QFNs                 ■ Reflowable in air and nitrogen conditions

■ Wide reflow profile window with good solderability on various PCB surface finish

RoHS Compliance

This product meets the requirements of the Restriction of Hazardous Substances (RoHS) Directive. Additional RoHS information is located at https://www.kester.com/downloads/environmental.

Physical Properties (typical)

Viscosity (typical): 1300 poise Malcom Viscometer @ 10 rpm, 25℃

Hot Slump Test: Pass Tested per J-STD-005, IPC-TM-650, Method 2.4.35

Initial Tack: 30gm Tested per J-STD-005, IPC-TM-650, Method 2.4.44

Solder Ball Test: Pass Tested per J-STD-005, IPC-TM-650, Method 2.4.43

Cold Slump Test: Pass Tested per J-STD-005, IPC-TM-650, Method 2.4.35

Wetting: Pass Tested per J-STD-005, IPC-TM-650, Method 2.4.45

Reliability Properties

Copper Mirror: Low Tested to J-STD-004, IPC-TM-650, Method 2.3.32

Silver Chromate: None Detected Tested to J-STD-004, IPC-TM-650, Method 2.3.33

Surface Insulation Resistance (SIR): Pass Per IPC-TM-650 Method 2.6.3.7 [40℃, 90% RH, 12.5V, 7days]

Copper Corrosion: Low Per IPC-TM-650 Method 2.6.15

Fluoride Spot Test: None Detected Tested to J-STD-004, IPC-TM-650, Method 2.3.35.1

Electrochemical Migration (ECM): Pass Per IPC-TM-650 Method 2.6.14.1 [65℃, 90% RH, 100V, 25days]

Halogen Content: None Detected Per IPC-TM-650, Method 2.3.81

Availability

NP560 is available in Sn96.5Ag3Cu0.5 alloy with Type 3 (T3), Type 4 (T4) and Type 5 (T5) powder mesh. Type 4 mesh size is recommended for standard and fine pitch applications. Type 5 is recommended for ultra-fine pitch applications. NP560 is also compatible with other SnAgCu alloys in similar melting range to the listed alloy. For specific packaging information, refer to Kester’s Solder Paste Packaging Chart for available sizes. The appropriate combination depends on the process variables and the specific application.

Process Guidelines

Below information are process guidelines, and it is advisable to note that the optimum setting for a given assembly may vary and this is dependent on the circuit board design, board thickness, components used, and equipment used. A design of experiments is recommended to be done to optimize the soldering process.

In addition, incoming solderability inspection of circuit boards and components is recommended as part of process control to maintain consistent soldering performance and electrical reliability.

Note: TAL should be calculated based on the liquidus point of the alloy used: SAC305 221°C. Adding a soak between 180 and 200°C for 20-30 seconds can further reduce voiding and reduce the potential for tombstoning.

The recommended reflow profile for NP560 formula made with SAC alloys is shown here. This profile is simply a guideline. NP560 has excellent solderability and wetting across a wide range of profiles, with similar performance in air and nitrogen. Your optimal profile may be different from the one shown based on your oven, board and mix of defects. For optimal reflow profile for void reduction or additional profiling advice, contact Kester Technical Support.

Cleaning

NP560 residues are non-conductive, non-corrosive, and do not require removal. If it is desired to remove the residues, commercially available residue cleaner may be used. Contact Kester Technical Support for additional assistance.

Storage, Handling and Shelf Life

The shelf life for NP560 T3 and T4 is 12 months from the date of manufacture when stored in refrigeration and can be stored up to 4 weeks at room temperature (up to 27°C/80°Fwith minimal impact to overall product performance. NP560 T5 has a refrigerated shelf life of 6 months. Refrigeration (0-10°C/32-50°F) is the recommended storage condition for solder paste to maintain consistent viscos- ity, reflow characteristics, and overall performance. When refrigerated, NP560 should be stabilized to room temperature prior to use. Please contact Kester Technical Support if you require additional advice with regards to handling and storage of this material.

Health and Safety

This product, during handling or use, may be hazardous to your health or the environment. Read the Safety Data Sheet and warning label before using this product. Safety Data Sheets are available at https://www.kester.com/downloads/sds.