TSF-WS917-1是一种水溶性粘性助焊剂，Post-reflow残留物完全溶于水，在低至40°C的温度下即可冲洗掉，不需要添加清洁添加剂。

Kester TSF-WS917-1 is a water-soluble tacky soldering flux formula with a unique halogen-free activator system. TSF-WS917-1 is designed to attain stable viscosity even at high temperature staging (up to 56°C) which is crucial to achieve consistent quality and high yield in customer mass productionenvironment. TSF-WS917-1 is highly active even without halogens. It can be used as a drop-in replacement for a variety of metallurgies including: Sn-Pb eutectic and higher melting point lead-free alloys such as Sn, SnAg, SnCu, SnAgCu and other alloy compositions. Post-reflow residues are completely soluble in water which can be readily rinsed off at temperature as low as 40°C and do not require cleaning additives.

Recommended Package Type

BGA/CSP Ball Attach, FC-CSP/FC-BGA Attach, SiP FC Attach, BGA Mount on PCB, Wafer Level Package Solder Ball Bumping (WLCSP & FOWLP), 2.5D/3D Flip Chip Attach and other Flip Chip Packaging that require DI Water flux cleaning.

RoHS Compliance

This product meets the requirements of the Restriction of Hazardous Substances (RoHS) Directive, 2011/65/EU for the stated banned substances.

Recommended Reflow Profile

TSF-WS917-1was developed to work on both short and long reflow profile shown below for various leadfree alloys such as Sn98.2Ag1.8, Sn96.5Ag3.5, Sn99.3Cu0.7 and/or other various SnAgCu alloys. This profile is simply a guideline. TS-WS917-1 was engineered to be versatile and robust for customer reflow process. The optimal profile varies depending on device, component design, fixture, package design and device defect challenges. Please contact Kester Technical Support if you need additional profiling advice.

Product Technical Summary

Health and Safety

This product, during handling or use, may be hazardous to your health or the environment. Read the Safety Data Sheet and warning label before using this product.