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产品描述
CT227L是一种以环氧树脂为基础的非溶剂型糊料。该膏体具有较高的粘接强度，适用于小型芯片(如led芯片)的贴装。
1.Introduction
Die Attach Paste CT227L is a epoxy resin based and non solvent type paste.
This paste is effectively used for small chip (ex.LED chip) mounting because of its high adhesive strength.
2.Features
1) Good workability due to one liquid type.
2) Good electrical conductivity
3) Good adhesion strength to several lead flames.
