Interconnections Wires
- Gold Wire
- 1%Si / Al Wire
- Heavy Wire
- Copper Wire
- Nickel Wire
- Copper Cored Wire
- Kovar Wire
- Molybdenum Wire
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Hybrid Integrate Circuit Materials
- AIN Substrate & BeO Substrate & DBC Substrate & Aluminum Anodization Substrate
- Thick Film Materials
- Heat Sink
- Precious Metals
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Polymer and Adhesive Materials
- General Adhesive & Conformal Coating Adhesive
- Moisture & Heat Resistance Adhesive
- Die Attach Adhesives
- Potting Resin & Encapsulant Resin
- UV Adhesive
- Structure Adhesive
- Molding Compound
- ( Materials Properties:
Epoxy Systems/Silicon Systems/PU Systems/Polymide Systems )
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Alloy Preforms Materials
- Soft Solder
- Hard Solder
- Brazing Solder
- Shape Type: Preform, Ribbon, Wire, Foil, Ball
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Paste Materials
- Solder Paste & Solder Flux for Circuit Assembly
- Wafer Bumping Paste
- Die Attach Paste
- Component Assembly Paste
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Spare Parts Value-added Service—— for Packaging Machine
- K&S,ESEC,OE,Sinkawa Wire bonder
- ASM,Alphasem,Tosok Die bonder
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