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产品名称CT220HK-S1

所属分类导电银浆材料
概要信息
CT220HK-S1是以环氧树脂为基材的无溶剂型银浆,适合蘸胶工艺。能够适合于小型芯片的LED的装片用途,具有优异的可靠性。
产品描述

CT220HK-S1是以环氧树脂为基材的无溶剂型银浆,适合蘸胶工艺。能够适合于小型芯片的LED的装片用途,具有优异的可靠性。

1.Introduction

Die Attach Paste CT220HK-S1 is a epoxy resin based and non solvent type paste. This paste is

effectively used for LED chip mounting because of its high adhesive strength.

2.Features

1) Good workability due to one liquid type.

2) High adhesive strength.

3) Bleedless during cure.

4) Low ionic impurity content, and high reliability.

3.General Property

4. Standard Cure Condition

  150℃×1.5h

5. Remarks

 

  Storage condition is under –15 degrees C