LORD Thermoset SC-315是双组份体系导热硅封装剂，设计用于具有优异的阻燃性和表现出较低的收缩和应力，为固化系统提供优异的耐高温性，连续工作温度可达200℃。
LORD Thermoset SC-315 thermally conductive silicone encapsulant is a two-component system designed to provide excellent thermal conductivity for electrical/ electronic encapsulating applications, while retaining desirable properties associated with silicones.
Features and Benefits
Low Stress – exhibits low shrinkage and stress on components as it cures. Durable – composed of an addition-curing polymer that will not depolymerize when heated in confined spaces. Low Viscosity – maintains low viscosity for ease of component encapsulation compared to other highly thermal conductive materials. High Temperature Resistant – provides excellent resistance for cured system that experiences continuous operating temperature up to 200°C; provides excellent thermal shock resistance.
UL Rated provides excellent flame retardancy; UL 94 V-0 certified.
Mixing Thoroughly stir each component prior to mixing together. Mix Thermoset SC-315 resin with Thermoset SC-315 hardener at a 1:1 ratio, by weight or volume, until uniform in color. Automatic meter/mix/dispense equipment may be used for high volume production.
Unless a closed-chamber mechanical mixer is used, air will be introduced into the encapsulant system either during mixing or when catalyzing the mixture. Electrical properties of the silicone encapsulant are best when air bubbles and voids are minimized. Therefore, in extremely high voltage or other critical applications, vacuuming may be appropriate.
Applying Apply silicone encapsulant using
handheld cartridges or automatic meter/mix/dispense equipment.
Avoid applying Thermoset SC-315 encapsulant to surfaces that contain cure inhibiting ingredients, such as amines, sulfur or tin salts. If bonding surface is in question, apply a test patch of Thermoset SC-315 encapsulant to the surface and allow it to set for the normal cure time.
**Cure schedule of 2 hours @ 80°C. Data is typical and not to be used for specification purposes.
Curing Allow encapsulant to cure for 30 minutes at 80°C, or for 24 hours at room temperature (25°C). This time-at-temperature profile refers to the time the bondline should be allowed to cure once it reaches the target temperature. Allowance should be made for oven ramp rates, parts with large thermal mass and other circumstances that may delay bondline actually reaching the target temperature.
Shelf life of each component is nine months from date of manufacture when stored at 25°C in original unopened container.
Thermoset SC-315 encapsulant evolves minute
quantities of hydrogen gas. Do not repackage or store material in unvented containers. Adequately ventilate work area to prevent the accumulation of gas.
Before using this or any LORD product, refer to the Safety Data Sheet (SDS) and label for safe use and handling instructions.
For industrial/commercial use only. Must be applied by trained personnel only. Not to be used in household applications. Not for consumer use.
Values stated in this technical data sheet represent typical values as not all tests are run on each lot of material produced. For formalized product specifications for specific product end uses, contact the Customer Support Center.
Information provided herein is based upon tests believed to be reliable. In as much as LORD Corporation has no control over the manner in which others may use this information, it does not guarantee the results to be obtained. In addition, LORD Corporation does not guarantee the performance of the product or the results obtained from the use of the product or this information where the product has been repackaged by any third party, including but not limited to any product end-user. Nor does the company make any express or implied warranty of merchantability or fitness for a particular purpose concerning the effects or results of such use.
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