Stress-Free, Very High
Epoxy Paste Adhesive
High Power Die Attach
Substrate and Component Attach
ME7156-M is a reworkable, boron nitride filled, electrically insulating and thermally conductive epoxy paste adhesive. It exhibits outstanding flexibility for bonding materials having highly mismatched CTE's (i.e., alumina to aluminum, silicon to copper). The very high thermal conductivity of this material makes it useful for bonding high-powered, large area die and components.
It can be readily reworked at 80-100?C with torque or peel stress.
ME7156-M is available in syringes for automatic needle dispense applications or in jars.
( 1 ) Thaw for 30 minutes before opening jar.
( 2 ) Dispense adhesive onto clean substrate.
( 3 ) Cure according to one of the recommended schedules.
Temperature Time Presure
Storage temperature Shelf Life
Pot Life 72 hrs@ 25℃