Low Moisture Absorption
Low lonic Impurities(<5 ppm Cl, Na+, K+)
High Temperature Stability
Chip or Component Bonding
MC7883 is a one part, quartz filled cyanate ester high temperatureadhesive. It is designed for use in both chip and component level bondingapplication to reduces stresses. It can withstand temperatures up to 350 Cwithout thermal degradation. Its unique chemistry results in very lowmoisture absorption, high adhesive strength.
MC7883 is designed to be dispensed or screen printed for bonding. Oncecured, adhesive achieves less than 29 ppm/C and higher than 6 Gpamodulus for unparalleled reliability.
MC7883 is available in syringes for automatic dispense applications.
(1 )Thaw to room temperature before opening container.
(2 ) Dispense adhesive onto clean substrate with a suitable pattern to
(3 )Cure according to the recommended schedule
NOTE: The monomer contained in this product is subject tocrystallization even at room temperature. If product is thawed andremains crystallized, simply place in 40 C environment for as long asneeded to return product to the liquid state i.e. usually not more that15-20 minutes.
Temperature Time Presure
Post cure at temperature above curing for at least 30 minutes ifoperating at temperatures beyond the curing temperature listed
1cP=10-3Pa-s=1mPa·s;145psi=.99974MPa=.99974N'm²;1lb =4.448N: 1 inch=25.4 mm: 1V/mil=393701 V/mm: 1 lb-in0.11298N-m
Storage temperature Shelf Life