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产品名称ESP8660-HK

所属分类DAF膜
概要信息
产品描述

High Moisture Resistance

Electrically Conductive

Epoxy Film Adhesive

IDEAL FOR:

High Volume, Automated Assemblies

Substrate Attach

Wafer Level Die-Attach

DESCRIPTION:

ESP8660-HK is a silver filled high-bond strength epoxy film adhesive. It can be used in die-cut preform for ease 

of pick-and-placement. This new generation film can also be incorporated with wafer dicing tape and packaged together into one DDAF (Dicing Die Attach Film).

It is designed for bonding component and substrate to substrate and carrier with matched thermal coefficients of expansion. ESP8660-HK has good thermal stability. The dry, tack-free handling of the film makes it suitable for an automated assembly.

AVAILABILITY:

ESP8660-HK is available in sheet sizes or rolls. Standard thickness of ESP8660-HK are 15 microns and 30 microns. Special thicknesses are available.

APPLICATION PROCEDURE

( 1 ) Keep product in aluminum polylaminate protective bag when not in use.

( 2 ) Before using, remove protective release liner from film. Place wafer onto adhesive film.

( 3 ) Laminate (low heat) wafer onto adhesive film until good wetting is achieved.

( 4 ) Cure according to one of the recommended schedules.

TYPICAL PROPERTIES*

CURE SCHEDULES:

Temperature   Time     Pressure

125ºC            1 hr           8-10 psi

150ºC            30 min         8-10 psi

The die or component can also be tacked on the substrate at 80ºC or higher with 10 psi. When a fillet around the edge of the die or component is observed, the pressure can be released for the rest of the bonding cycle.

SHELF LIFE:

Storage temperature                       Shelf Life

0-5ºC                                                     1 yr  in sealed package