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产品名称ESP8450-SC

所属分类DAF膜
概要信息
Tacky-Free Epoxy Film Not Measurable Electrical Conduct Moisture-Temperature Resistant -55℃ Tg : Flexible "Stress-Free"
产品描述

Tacky-Free Epoxy Film

Not Measurable Electrical Conduct

Moisture-Temperature Resistant

-55℃ Tg : Flexible "Stress-Free"

IDEAL FOR:

Large Area Die Attach

Mismatched CTE Substrate Attach

Thermal Ground Plane Bonding

Wafer Lamination and Stack-chip Bonding

DESCRIPTION:

ESP8450-SC is a fast curing, high melt-flow version of standard ESP8450 with ultra-high thermal conductivity and low thermal resistance. It is designed for large area bonding and wafer-level lamination for stack-chip applications. It is a solvent resistant, silver-filled, flexible epoxy film adhesive designed for bonding die, component and substrate to a mismatched substrate or carrier. This novel, B-staged non-electrically conductive adhesive offers excellent flexibility from -55-150ºC.

ESP8450-SC has excellent thermal conductivity and its low Tg adhesive imposes minimum thermal stress on bonded parts during thermal cycling or shock testing.

AVAILABILITY:

ESP8450-SC is available in sheet sizes or as custom preforms. Standard thicknesses are 0.003" and 0.006". Special thicknesses are available.

APPLICATION PROCEDURE

( 1 ) Let product stay at room temperature for 15 minutes. Remove film from protective paper.

( 2 ) Cut to desired size.

( 3 ) Place on substrate and cure according to one of the recommended schedules.

TYPICAL PROPERTIES*

CURE SCHEDULES:

Temperature          Time        Pressure

80℃                   120min       10psi

120℃                  30min        8psi

150℃                  5min         5psi

The die or component can also be tacked on the substrate at 100℃ or higher with nominal placement pressure. When a fillet around the edge of the die or component is observed, the pressure can be released for the rest of the bonding cycle.

SHELF LIFE:

Storage temperature     Shelf Life

25℃               1yr

in sealed container