欢迎进入铭奋电子科技官网 - 专业销售半导体封装材料及提供工艺设计和解决方案

Products

产品中心

产品中心

相关文件

暂时没有内容信息显示
请先在网站后台添加数据记录。

产品名称Thermoset GF-1500

所属分类灌封材料
概要信息
LORD CoolThermTM SC-1500导热硅隙填料是一种双组分系统,为电子应用提供良好的导热性。
产品描述

LORD CoolThermTM SC-1500导热硅隙填料是一种双组分系统,为电子应用提供良好的导热性。

Description

LORD CoolThermTM SC-1500 thermally conductive silicone gap filler is a two-component system designed to provide excellent thermal conductivity for electronic applications, while retaining desirable properties associated with silicones.

Features and Benefits

Low Stress – exhibits low shrinkage and stress on components as it cures.

Durable – composed of an addition-curing polydimethyl siloxane polymer that will not depolymerize when heated in confined spaces.

Environmentally Resistant – provides excellent thermal shock resistance.

Application

Mixing – Mix CoolTherm SC-1500 resin with CoolTherm SC-1500 hardener at a 1:1 ratio, by weight or volume. Handheld cartridges or automatic meter/mix/dispense equipment should be used to avoid any air entrapment in the material. Manual mixing is not recommended.

Applying – Apply material using handheld cartridges or automatic meter/mix/dispense equipment.

· Handheld Cartridges

1. Load the cartridge into the applicator gun and remove the end caps.

2. Level the plungers by expelling a small amount of material to ensure both sides are level.

3. Attach mixing tip and expel a mixer’s length of material.

4. Apply material to substrate and mate the parts within the working time of the gap filler. Clamp in position until material reaches handling strength.

· Meter/Mix/Dispense Equipment

Contact your LORD representative if assistance is needed using this equipment.

Avoid applying CoolTherm SC-1500 gap filler to surfaces that contain cure inhibiting ingredients, such as amines, sulfur, or tin salts. If bonding surface is in question, apply a test patch of gap filler to the surface and allow it to set for the normal cure time. A liquid layer of silicone will remain on the surface if an inhibitor is present.

Typical Properties*

Typical Cured Properties**

Curing – Allow material to cure for 24 hours at room temperature (25°C) or for 30 minutes at 100°C. This time-at-temperature profile refers to the time the material should be allowed to cure once it reaches the target temperature. Allowance should be made for oven ramp rates, parts with large thermal mass and other circumstances that may delay material reaching the target temperature.

Shelf Life/Storage

Shelf life of each component is three months from date of manufacture when stored at 25°C in original, unopened container.

CoolTherm SC-1500 gap filler evolves minute quantities of hydrogen gas. Do not repackage or store material in unvented containers. Adequately ventilate work area to prevent the accumulation of gas.

Cautionary Information

Before using this or any LORD product, refer to the Safety Data Sheet (SDS) and label for safe use and handling instructions.

For industrial/commercial use only. Must be applied by trained personnel only. Not to be used in household applications. Not for consumer use.