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SC-309灌封胶

详情介绍

 

Features and Benefits:

  • Low Stress – exhibits low shrinkage and stress on components as it cures.

  • Durable – composed of an addition-curing polydimethyl siloxane polymer that will not depolymerize when heated in confined spaces.

  • Low Viscosity – maintains low viscosity for ease of component encapsulation compared to other highly thermal conductive materials.

  • Environmentally Resistant – provides excellent thermal shock resistance.

  • UL Rated – provides excellent flame retardancy; UL 94 V-O certified.

Uncured Typical Properties*

Mixed AppearanceLight Gray Liquid
Mixed Viscosity, cps @ 25°C3600
Mixed Specific Gravity1.66
Gel Time, min @ 50°C5 - 9
Working Life, min @ 25°C30

Cured Typical Properties*

Volume Resistivity, ohm-cm @ 25°C4.3 x 1013
Thermal Conductivity, W/mK1.0
Coefficient of Linear Thermal Expansion, ppm/°C190
Hardness, Shore A45
Tensile Strength, MPa0.34
Moisture Absorption, %< 0.5
Dielectric Strength, V/mil600
Dielectric Constant, @ 25°C4.0
Dissipation Factor, % @ 25°C0.004

Thermoset SC-309 Resin - Typical Properties*

AppearanceGray Liquid
Viscosity, cps @ 25°C3500
Specific Gravity1.66

Thermoset SC-309 Hardener - Typical Properties*

AppearanceWhite Liquid
Viscosity, cps @ 25°C3500
Specific Gravity1.66

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